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XDS560 Non-Intrusive Real-Time Debugging - Texas Instruments

Posted in Development Tools, Compiler Assembler, Texas Instruments
On Tuesday, March 20, 2007

Texas Instruments and EWA Blackhawk deliver the XDS560 Trace module, a hardware-based,  non-intrusive trace tool. This tool offers enhanced debugging facility for real-time embedded applications. Real-time visibility and a high-speed interface provide developers with the detailed information to determine where and why the problems occur.

Real-time bugs are very difficult to track down, because the bugs appear intermittently and can effect overall system context. Bugs of this nature include race conditions, scheduling conflicts, crashes and false interrupts. The XDS560 Trace module is well-suited for identifying and resolving these types of bugs, employing a circular buffer to build a complete history of application execution with a completely non-intrusive, real-time data capture.

One challenge with real-time bugs is that an application can continue running for some time before an error manifests itself. The XDS560 Trace module specifically addresses this issue through the ability to trace back over millions of program branches, guaranteeing that the root cause will be captured within the trace buffer.



Traditionally, developers must either use a simulator or intrusively breakpoints code. Simulators run slower than actual applications and breakpoints codes significantly altering code performance and limiting coverage. With the XDS560 Trace module, developers can non-intrusively capture every cycle count for every line of code, enabling them to first determine which function or block of code is performing poorly and then optimize overall operation.

Example, two functions that use the same cache line can create contention. Trace provides complete code visibility enabling developers to pinpoint the exact program line causing contention and quickly resolve it.

The XDS560 Trace module utilizes a high-density header 60-pin connector, as well as compression technology, to increase the effective bandwidth available for capturing real-time data values. While requiring approximately the same board space as a standard JTAG connector and providing full JTAG capabilities, the HD connector is also capable of interfacing directly to the integrated trace module on 17 of TI's currently available DSPs, and future processors will be trace enabled as well.

The XDS560 Trace module is comprised of the XDS560 high-speed USB emulator developed by Blackhawk, a division of EWA, and TI's Trace module design with high-density (HD), 60-pin header connector. Specialized watchpoints based on hardware-based state machines enable complex, real-time advanced event triggers to start and stop data capture.

Price XDS560 Trace development tool is $9,995, including Blackhawk XDS560 USB emulator and TI's Trace pod (compatible with TMS320C6455 SRIO EVM, TMS320DM642 EVM and TMS320C6416T).

Source: XDS560 Trace Module development tool - TI


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