Ultra-Thin EMI with Integrated ESD Protection - IP4253 and IP4254 - NXP

NXP announced the IP4253 and IP4254, EMI filters chips with integrated ESD protection capability. The chip is available in Ultra-Thin Leadless Package (UTLP), very small, the height is only 0.5 mm and a pad pitch of 0.4 mm.  These EMI - ESD chip are targeted for slim portable applications such as mobile phones, PDAs, GPS navigators and  MP3 players.

Features such as Radio, Bluetooth and MP3, LCD displays, mobile TV and video cameras is source of RF interference in mobile devices. RF transceiver in the handset interferes with more interfaces, making a higher degree of EMI filtering essential. Further, the core ICs in mobile multimedia devices also require a higher level of protection from electrostatic discharge, since they are manufactured using smaller process technologies to enable a higher level of integration. By delivering high-quality EMI filtering with high ESD protection (±30 kVolt), the IP4253 and IP4254 EMI filters address that critical need.

Frans Scheper, NXP, said:

With the NXP IP4253 and IP4254 series in UTLP, handset manufacturers can take advantage of the ultra-compact EMI filters which vastly reduce the size of the PCB and double the level of integrated ESD protection available for their thinnest handset designs. For consumers, this means more brilliant displays and higher sound quality on the slimmest and most stylish handsets…

The breakthrough in ultra-thin EMI filters is enabled by the UTLP platform developed by NXP. The UTLP gives designers the flexibility to add more functionality into smaller spaces in consumer electronics products, through  substrate and etching technology. UTLP’s shorter wire length and internal traces, increases the silicon-to-plastic-ratio and contribute less parasitic inductance and capacitance compared to other plastic packages. This is nice for high-frequency applications.

About Ultra-Thin Leadless Package (UTLP)
The new EMI filters is package in NXP’s UTLP. This technology offer a 90% space reduction compared to alternative discrete technology. Pad pitch of only 0.4 mm enable a space reduction of more than 30% compared to alternative solutions in a 0.5-mm pitch size.

Other NXP products currently available in UTLP include the IP4221CZ6-XS ESD protection chip, which features a record 0.35-mm pitch.

The IP4253 and IP4254 EMI filters in UTLP are available immediately.

Source: EMI Filter and ESD Protection - NXP