New Military and Aerospace Grade Microelectronic Components - Honeywell

Honeywell announced several new electronic components for military and aerospace applications.For these applications, electronic components must reliable to withstand the vibration, shock and extreme radiation environments. The components are developed using the Honeywell's radiation-hardened, silicon-on-insulator (SOI) CMOS technology.

The new Honeywell’s military and aerospace grade electronic components are:

• HX5000
  An ASIC with radiation-hardened technology. The HX5000 can be configured by customers using the Synopsys Design Automation Galaxy ASIC design software to integrate digital logic, microcontrollers, multi-channel multi-gigabit per second communication port and static memory functions onto a single integrated circuit.
• HXSRO1608
  A 16M-bit SRAM that provides a memory function four times the memory density than earlier SRAM components. The HXSRO1608 features 60% lower power and requires 75% less circuit board space than previous available 5V SRAM products.
• HXNVO100
  The 1 M-bit NV MRAM (Non Volatile Magnetic RAM) to combine SOI CMOS technology with magnetic thin films.
• RHPPC Processor
  A Freescale's 603e based with radiation-hardened technology. Applications include single board computers that manage data processing, and controls on satellites and launch vehicles.

Source: Honeywell’s military and aerospace grade electronic components