BCM2070 Bluetooth v 2.1 + EDR Processor for Mobile Phones - Broadcom

Broadcom has released the samples of its BCM2070 Bluetooth Processor. BCM2070 is a Bluetooth v2.1 + EDR single-chip solution that provides enhanced features and performance upgrades, including improved radio performance, lower power consumption, smaller chip size. BCM2070 Bluetooth Processor integrates a high performance 2.4 GHz Class 1 Bluetooth radio for improved output power. Based on 65 nm CMOS tech, BCM2070 Bluetooth Processor introduces new levels of performance for Bluetooth devices including the smallest available solution (enabling board space designs of less than 25mm2) and a savings in power consumption, suitable for Mobile Phone applications.

Broadcom BCM2070 Bluetooth Processor in a Typical Mobile Phone Application

Applications of BCM2070 Bluetooth Processor include:

• Cellular and mobile communication devices
• PDA and low-power embedded communication devices
• PC and integration on PC motherboard applications

Benefits of Broadcom BCM2070 Bluetooth Processor:

• Smallest packages, lowest power consumption, and highest performance Bluetooth 2.1 + EDR solution
• Maximizes range and simplifies system integration by providing exceptional output power and receiver sensitivity
• Unmatched integration tremendously simplifies board-level design for easy implementation
• Achieves smallest board area requirements with minimum external BOM and smallest package size available today
  • Standard PCB requirement is less than 35 mm2
  • WLBGA COB solutions are less than 20 mm2
• ROM-based solution with flexible and much improved code patching to ensure fast and easy integration
• On-chip voltage regulator lowers BOM requirements and provides additional power savings capability
• Minimized power dissipation over other solutions
  • 40% savings in power compared to the previous generation of products in standard telephony headset applications

Key Features of Broadcom BCM2070 Bluetooth Processor:

• Fully supports the Bluetooth 1.1, 1.2, 2.0, and 2.1 standards including 1-, 2-, and 3-Mbps EDR operation
• Processed with 65-nm LP CMOS technology
• Built-in power amplifier to support class 1 transmit output power
• Fully integrated balun and T/R switch eliminate all external RF matching components for class 1, 2, and 3 designs
• ROM-based solution to eliminate external flash and/or EEPROM memory
• Lowest current consumption in all modes of operation
• Highest available Bluetooth radio performance of any single chip solution
  • Programmable output power up to +12 dBm at 1.8V supply
  • -90 dBm typical receiver sensitivity
• Minimized external BOM requirements with less than 10 external passive components
• Flexible set of interfaces that include up to 4 Mbps UART, USB, H4, H5, USB, SDIO, I2C, and serial/parallel flash
• Fractional-N frequency synthesizer supports any crystal or TCXO source from 12 MHz to 40 MHz
• Supports applications with WLAN and WiMAX coexistence
• Proprietary packet redistribution scheme allowing up to five headsets simultaneous A2DP music streaming
• Automatic calibration and frequency detection of crystal frequency
• Supports wideband speech and packet-loss concealment for superior voice quality

Broadcom BCM2070 Bluetooth Processor allows the handset to stream stereo music to multiple users simultaneously using the advanced A2DP Bluetooth profile - a feature made increasingly attractive as handsets add advanced multimedia capabilities and move to the center of the personal area network. BCM2070 also integrates key elements of the Broadcom’s SmartAudio sound and voice enhancement technology that improves the audio quality of Bluetooth links. The audio enhancement technologies in the BCM2070 include Broadcom’s unique packet loss concealment (PLC) technology that reshapes audio streams, compensating for lost data packets and delivering clearer digital voice communications.

The BCM2070 Bluetooth Processor includes industry collaborative coexistence solutions with WLAN and WiMAX systems. BCM2070, employing Broadcom’s packet redistribution scheme, is capable of supporting up to five simultaneous A2DP applications.

BCM2070 Bluetooth Processor packages:

• 50-pin fpBGA package (4.5 mm x 4 mm)
• 42-bump wafer-level BGA (WLBGA) package

More information of BCM2070 Bluetooth Processor can be found at Broadcom website.