Ansoft Announce the First-Pass System Success Workshops
Posted in Seminar, Webinar, CourseOn Saturday, July 7, 2007
Ansoft has announced the First-Pass System Success, application workshops to take place from Sept. 12 through Nov. 15 2007 throughout North America, Europe and Asia. Ansoft engineers and leading technology companies will collaborate to discuss the latest simulation techniques and design methodologies to help engineers achieve first-pass system success when designing electronic systems.
Ansoft offers two types of presentation formats:
- Full-Length Papers (30 minutes):
Report significant contributions, advancements, or applications using Ansoft technology in a formal presentation format with limited audience interaction. - Interactive Poster Sessions:
Provide an opportunity for authors to present novel ideas or designs as well as theoretical or experimental results in an informal manner. Authors are encouraged to post printed slides, perform hardware or software demonstrations, or simply discuss topics of mutual interest with interested colleagues. (This session will be held in parallel with a number of product-training sessions.)
About Ansoft
Ansoft Corporation (NASDAQ:ANST) is a developer of high-performance electronic design automation (EDA) software. Engineers use Ansoft software to achieve first-pass system success when designing mobile communication and Internet-access devices, broadband networking components and systems, integrated circuits (ICs), printed circuit boards (PCBs) and electromechanical systems.
Topics include:
- IC design and verification
- RF, microwave and antenna design
- Signal- and power-integrity simulation
- Advanced packaging and PCB design
- Medical electronics
- Electromechanical and power systems design
- EMI/EMC
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Suggested topics:
| High-Frequency Systems | Signal and Power Integrity Solutions | Electromechanical Systems |
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Next-generation antenna design
Incorporating passive components into high-frequency, analog IC, and RFIC designs Optimization and synthesis of high-performance microwave components RCS and related aerospace applications Automotive RF applications, including RKE, Bluetooth®, SDARS, GPS, and EMI/EMC |
IC/package/PCB co-design
Advanced packaging: SIP, POP, and stacked packages Power integrity to support mixed-signal IC design RFID design Multi-gigabit-speed serial design: PCI Express Gen 2, HyperTransport 3, TMDS Utilizing compute farms to significantly reduce simulation time |
Power electronics and drives
Hybrid technology and automotive systems design VHDL-AMS (IEEE standard 1076.1) Electromechanical components Industrial automation |
Interested parties may submit a 100-word abstract for presentation by Aug. 31
More information: Ansoft First-Pass System Success Workshops
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