AMD Sempron Processor 2100+ and Geode LX 800 for Embedded System

AMD announced the new AMD Sempron Processor Model 2100+ and AMD Geode LX 800 @ 0.9W Processor for embedded system. The fanless AMD Sempron Processor Model 2100+ incorporates AMD64 technology in a 9W power envelope, providing advantages on delivering high performance and functionality in single board computing and embedded client systems.

AMD Geode
The AMD Geode LX 700@0.8W processor, the AMD Geode LX800@0.9W processor, and the new AMD Geode LX 900@1.5W processor bring x86 power and versatility to applications for entertainment, business, education, and embedded markets. The AMD Geode LX 900@1.5W processor is the most advanced Geode LX processor for demanding embedded applications. This level of capability may not be needed for every application, but when premium performance is needed, the AMD Geode LX 900@1.5W processor delivers. The AMD Geode LX processor's integrated, innovative architecture is one of the most energy-efficient x86 solutions in the industry and can lead to longer battery life and enable small form-factor designs.

Greg White, AMD, said:

By expanding our product portfolio with this new, very low power version of the highly successful AMD Sempron processor and extending the temperature support in our Geode line, AMD is delivering on our promise of customer-centric innovation for a range of embedded markets…

Applications such as single board computing, telecommunications infrastructure, transportation systems, automotive, and industrial control/monitoring often require temperature support in the -40 to +85 degrees Celsius range, which can now be supported with the AMD Geode LX 800 @ 0.9W processor.

A host of embedded board manufacturers have products available that will accommodate the extended temperature AMD Geode LX processor, including Advantech, AAEON, Arbor, ICP, and IBase, while both AAEON and Arbor offer boards that will accommodate the new AMD Sempron processor Model 2100+.

The AMD Sempron™ Processor Model 2100+

The AMD Sempron™ processor Model 2100+ is a unique fanless solution offering AMD64 technology features in a
9W TDP processor.

AMD Sempron Processor Model 2100+

It is an ideal foundation for single board computers requiring ever-increasing performance and functionality, and for  embedded client applications such as thin clients, Point-of-Sale (POS) systems, and kiosks. It is compatible with the  AMD M690T chipset. Supporting both 32– and 64-bit software, the AMD Sempron processor Model 2100+ also  features the high shock and vibration specification Socket S1, providing high reliability and making it an excellent choice for rugged environments.

The AMD64 platform gives embedded designers an opportunity to design with leading edge technology utilizing standard components to help increase system reliability and decrease design and production costs. AMD64 technology offers the robust ecosystem of an x86 platform with flexibility of HyperTransport technology, a high throughput system bus that speeds data through the system without the front side bus bottleneck of a traditional x86 processor.

Key specs. and features of AMD Sempron™ Processor Model 2100+

• The AMD64 Technology Core
  • Leading-edge performance for 32– and 64-bit applications
  • 1.0 GHz core frequency
  • Addressability beyond 4GB Controller
  • 9W CPU plus integrated memory controller, enabling fanless designs Integrated DDR2 Memory
  • Enhanced Virus Protection
  • AMD Digital Media Xpress™ technology provides support for SSE, SSE2, SSE3 and MMX™ instructions
• HyperTransport™ Technology Bus
  • Up to 6.4GB/s of available system bandwidth Technology
  • High-speed I/O Communication AMD64 Cache
  • Single 16-bit link up to 800MHz bidirectional
  • Helps reduce bottlenecks of traditional x86 systems
• Integrated DDR2 Memory Controller
  • Designed to reduce DRAM latency
  • Offers high-performance, high bandwidth
  • Unbuffered DDR2-400
• Large High-performance on chip Cache
  • 256KB L2 cache
  • 64KB Level 1 data cache
  • 64KB Level 1 instruction cache
• Packaging
  • Lidless for direct thermal management
  • Socket S1: 638 pin ouPGA
  • Socket is suitable for up to 50g shock and 7g three-axis vibration
  • Socket compatible with Mobile AMD Sempron 3500+ and AMD Turion 64™ X2 TL-52 processors

The AMD Geode™ LX 800 @ 0.9W Processor

The AMD Geode™ LX 800 @ 0.9W processor has evolved to meet the specific requirements of extended temperature applications in telecommunications infrastructure (including wired, wireless, and BSC/MSC), single board computing, automotive and transportation systems and industrial control and monitoring. AMD is now providing the high performance, very low power and x86 compatibility of the AMD Geode LX 800 @ 0.9W processor in an extended temperature version supporting –40 to +85 degrees Celsius.

AMD Geode LX 800 @ 0.9W Processor

This ideal foundation for extended temperature embedded systems is offered with the AMD Geode CS5536 companion device, which also now supports the industrial temperature range and is optimized to work with AMD
Geode LX processors to deliver an integrated solution with very low power consumption and internal data speeds  above 1 GB/s.

AMD Embedded solutions, including AMD Geode and AMD64 processors, support the embedded industry’s
business need to shorten design cycles and get systems to market fast. With a wealth of design tools and support
and a robust embedded processor roadmap with extended component longevity, AMD is a leader in enabling high performance, low power embedded designs.

Along with the creativity and innovation of our customers, AMD is helping push the embedded space further into
the future and enabling increasingly reliable, feature-rich embedded products—all on an industry-standard x86
architecture supporting all major operating systems and thousands of software applications.

Rely on AMD Embedded solutions and the AMD Geode LX 800 @ 0.9W processor for a high performance, low power, differentiated embedded system.

Key specs. and features of AMD Geode™ LX 800 @ 0.9W Processor

• x86/x87-compatible core
• 0.9W
• Processor frequency up to 500 MHz
• 64K I/64K D L1 cache and 128K L2 cache
• 64-bit DDR memory interface up to 400 MHz
• Split I/D cache/Translation Look-aside Buffer (TLB)
• Integrated FPU that supports MMX™ and AMD 3DNow!™ technology instruction sets
• 9 GB/s internal GeodeLink™ technology Interface Unit (GLIU)
• High-resolution CRT and TFT outputs (simultaneous operation) with support for High Definition (HD) and Standard Definition (SD) standards and support for 1920×1440 in CRT mode and 1600×1200 in TFT mode
• VESA 1.1 and 2.0 VIP/VDA support
• Security Block with 128-bit AES (CBC/ECB) and true random number generator
• 481-terminal Plastic Ball Grid Array (PBGA) with internal heatspreader
• I/O companion SUSP#/SUSPA# power controls
• Lower power I/O
• Hardware support for standard ACPI software power management
• Wakeup on SMI/INTR
• GeodeLink technology active hardware power management
• Support for Industrial Temperature range of –40 to +85 degrees Celsius

Further reading:  AMD Sempron Processor 2100+ and Geode LX 800 for Embedded System